Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer - Information about the patent

Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer
  • Status: Patente no validada
  • Country: Spain
  • Filing date: 06/06/2012
  • Request number:

    E12171065

  • Publication number:

    ---

  • Grant date:
  • Inventors:
    Soares Ceasar Da Silva Franco, Cibele
  • Information of the applicant:
    SEMIKRON Elektronik GmbH & Co. KG
  • Information of the representative:

  • International Patent Classification:
    C23C 18/16,C23C 18/18,C23C 18/40,H01L 21/288,H01L 31/0224
  • Publication's International Patent Classification:
    C23C 18/16,C23C 18/18,C23C 18/40,H01L 21/288,H01L 31/0224
  • Expiration date:

European patent for "Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer"

This application has been made by

SEMIKRON ELEKTRONIK GMBH & CO. KG

The products and services protected by this patent are:
C23C 18/16 - C23C 18/18 - C23C 18/40 - H01L 21/288 - H01L 31/0224

Publications:
EP2672520 (11/12/2013) - A1 Solicitud de patente europea con informe de búsqueda en la OEP
EP2672520 (04/07/2018) - B1 Patente europea en la OEP

Events:
On the date 11/12/2013 Publicación OEP Solicitud de Patente Europea con Informe de Búsqueda (A1) took place
On the date 26/03/2014 Modificación de Publicación con actualización de Datos en la OEP took place
On the date 11/04/2018 Publicación OEP Modificación de Datos took place
On the date 04/07/2018 Publicación OEP Patente Europea (B1) took place
On the date 04/07/2018 No Presentada Traducción took place
On the date 05/04/2019 Publicación OEP Oposiciones no presentadas took place


Information source:
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Information on the registration of european patent by Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065

The registration of european patent by Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065 was requested on the 06/06/2012. It is a record in Spain so this record does not offer protection in the rest of the countries. The registration Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065 was requested by SEMIKRON ELEKTRONIK GMBH & CO. KG. The registration of [modality] by Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065 is classified as C23C 18/16,C23C 18/18,C23C 18/40,H01L 21/288,H01L 31/0224 according to the international patent classification.

Other inventions requested by SEMIKRON Elektronik GmbH & Co. KG

It is possible to know all the inventions requested by SEMIKRON Elektronik GmbH & Co. KG, among which is the record of european patent by Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. If you want to know more inventions requested by SEMIKRON Elektronik GmbH & Co. KG click here.

Other inventions requested in the international patent classification C23C 18/16,C23C 18/18,C23C 18/40,H01L 21/288,H01L 31/0224.

It is possible to know inventions similar to the field of the technique concerned. The registration of european patent by Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065 is classified with the classification C23C 18/16,C23C 18/18,C23C 18/40,H01L 21/288,H01L 31/0224 so if you want to know more records with the classification C23C 18/16,C23C 18/18,C23C 18/40,H01L 21/288,H01L 31/0224 click here.

Patents in Spain

It is possible to know all the inventions published in Spain, among which the registration european patent by Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer. Our website www.patentes-y-marcas.com offers access to patent publications in Spain. Knowing the patents registered in a country is important to know the possibilities of manufacturing, selling or exploiting an invention in Spain.

Registered patents in class C

It is possible to know all the patents registered in class C (CHEMISTRY; METALLURGY) among which is the patent Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. Knowing the patents registered in a class is important to know the possibilities of registering a patent in that same class.

Registered patents in class C23

It is possible to know all the patents registered in class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFF) among which is the patent Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. Knowing the patents registered in a class is important to know the possibilities of registering a patent in that same class.

Registered patents in class C23C

It is possible to know all the patents registered in class C23C (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MA) among which is the patent Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. Knowing the patents registered in a class is important to know the possibilities of registering a patent in that same class.

Registered patents in class H

It is possible to know all the patents registered in class H (ELECTRICITY) among which is the patent Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. Knowing the patents registered in a class is important to know the possibilities of registering a patent in that same class.

Registered patents in class H01

It is possible to know all the patents registered in class H01 (BASIC ELECTRIC ELEMENTS) among which is the patent Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. Knowing the patents registered in a class is important to know the possibilities of registering a patent in that same class.

Registered patents in class H01L

It is possible to know all the patents registered in class H01L (SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICESNOT OTHERWISE PROVIDED FOR) among which is the patent Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer with the number E12171065. Knowing the patents registered in a class is important to know the possibilities of registering a patent in that same class.